Thermal pad
Model : RP-002
APPLICATION :
DT/ NB /Tablet PC /Tablet PC : CPU, INDUSTRIAL PC, SERVER & WORK STATION, NETWORKING & COMMUNICATION, SMART PHONE, POWER SUPPLY, FLAT PANEL DISPLAY, LED LIGHTING, AUTOTRONICS.
| Properties | Unit | SP-1 | Test Method |
| Color | Gray | Visual | |
| Thickness Range | mm | 0.2 ~ 5.0 | Teclock SM -112 |
| Thickness Tolerance | % | +/ - 10 | Teclock SM -112 |
| Thermal Conductivity | W/mK | 2. 3 | HOT DISK |
|
Thermal Impedance
1mm Thick ＠10psi @80℃ |
℃· in2 /W | 0. 534 | ASTM D5470 |
|
Thermal Impedance
1mm Thick ＠50psi @80℃ |
℃· in2/W | 0.317 | ASTM D5470 |
| Specific Gravity | 2.8 | ASTM D792 | |
| Hardness | Shore 00 | 35 | ASTM D2240 |
| Tensile Strength | MPa | 0.6 | ASTM D412 |
| Elongation | % | 80 | ASTM D412 |
| UL Flammability Rating | 94 V -0 | UL QMFZ2 | |
| Operating Temperature | ℃ | -50 ~ 200 | - |
| Volume Resistivity | ohm •cm | 2 x 1012 | ASTM D257 |
| Breakdown Voltage | KV/mm | 8 | ASTM D149 |
| RoHS | Pass ( No. : CE /2016/42160) | Pass ( No. : CE /2016/42160) | SGS Lab. |